As the country invests more and more in the semiconductor industry, the number of domestic semiconductor enterprises is also increasing, and the demand for semiconductor production equipment from production enterprises or scientific research, universities and institutes is also increasing. From the growth of the wafer to the detection of the finished product of the chip, the temperature control equipment is always used in the whole process of chip manufacturing.

The process flow and links involved in wafer manufacturing include: making silicon wafers in single crystal furnace,Oxidation diffusion carried out by oxidation diffusion furnace, Cleaning machine Cleaning, polishing the CMP equipment, Ion implantation, Deposition by sputtering target material, Etching by etcher , Lithography by lithography machine.

During this process, the equipment need to use temperature control includes: single crystal furnace, ICP-RIE, lithography machine, Plasma flush unit, Quick anneal oven, Vapor deposition(PVDCVD), Molecular beam epitaxy, Dicing saw, Die-bonder, Cryogen Probe Stations ,etc.

For the single crystal furnace, the appropriate temperature is very important for the growth of crystals, and there should be enough cooling water to cool the furnace body, heating electrode and vacuum system. Etching machine also needs cooling, whether wet etching or dry etching, if the temperature is not properly controlled, there will be incomplete etching, over etching, or drilling corrosion and other problems, leading to the failure of the process.

In dry etching, both plasma and ion beam etching need to control the temperature of the vacuum system and the reaction cavity to offset the heat generated by the electrode RF coil.

There are many similar temperature control requirements, such as: sputtering target material, electron gun, abrasive material, electromagnet, helium compressor, spindle, etc. These parts need enough cooling water to carry away the heat to ensure the normal use of the equipment.

As the country invests more and more in the semiconductor industry, the number of domestic semiconductor enterprises is also increasing, and the demand for semiconductor production equipment from production enterprises or scientific research, universities and institutes is also increasing. From the growth of the wafer to the detection of the finished product of the chip, the temperature control equipment is always used in the whole process of chip manufacturing.

The process flow and links involved in wafer manufacturing include: making silicon wafers in single crystal furnace,Oxidation diffusion carried out by oxidation diffusion furnace, Cleaning machine Cleaning, polishing the CMP equipment, Ion implantation, Deposition by sputtering target material, Etching by etcher , Lithography by lithography machine.

During this process, the equipment need to use temperature control includes: single crystal furnace, ICP-RIE, lithography machine, Plasma flush unit, Quick anneal oven, Vapor deposition(PVDCVD), Molecular beam epitaxy, Dicing saw, Die-bonder, Cryogen Probe Stations ,etc.

For the single crystal furnace, the appropriate temperature is very important for the growth of crystals, and there should be enough cooling water to cool the furnace body, heating electrode and vacuum system. Etching machine also needs cooling, whether wet etching or dry etching, if the temperature is not properly controlled, there will be incomplete etching, over etching, or drilling corrosion and other problems, leading to the failure of the process.

In dry etching, both plasma and ion beam etching need to control the temperature of the vacuum system and the reaction cavity to offset the heat generated by the electrode RF coil.

There are many similar temperature control requirements, such as: sputtering target material, electron gun, abrasive material, electromagnet, helium compressor, spindle, etc. These parts need enough cooling water to carry away the heat to ensure the normal use of the equipment.